Toolbox for 3D Imaging of Manufactured Electronic Circuits

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Harvey, DM, Zhang, GM, Baishya, K and Braden, DR (2016) Toolbox for 3D Imaging of Manufactured Electronic Circuits. In: IEEE ESTC 2016, 13 September 2016 - 16 September 2016, Grenoble France. (Unpublished)

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Item Type: Conference or Workshop Item (Paper)
Subjects: T Technology > TK Electrical engineering. Electronics. Nuclear engineering
Divisions: Engineering
Publisher: IEEE
Date of acceptance: 13 April 2016
Date of first compliant Open Access: 28 November 2016
Date Deposited: 28 Nov 2016 10:22
Last Modified: 13 Apr 2022 15:14
URI: https://ljmu-9.eprints-hosting.org/id/eprint/4793
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